What is semiconductor packaging?
Semiconductor packaging refers to the process of manufacturing individual chips from the tested wafers according to the product model and functional requirements. Encapsulation process for: from the wafer wafer fabrication process by scribing process was cut into small chips (Die), and then cut chips use glue to stick to the corresponding substrate (Lead frame) island, reuse ultrafine metal (jinxi copper aluminum conductor or conductive resin will wafer bonding Pad (Bond Pad) connected to the substrate to the corresponding pin (Lead), and the required circuit; Then the independent chip is sealed and protected with a plastic shell, and a series of operations are required after the packaging. After the packaging is completed, the finished product is tested, and it usually passes the Incoming inspection, Test, Packing and other processes before finally being put into storage and shipped.
What are the three semiconductor packages?
Semiconductor three packaging is based on the materials used to divide the semiconductor device packaging forms are metal packaging, ceramic packaging, metal - ceramic packaging and plastic packaging.
The first category: semiconductor metal packaging
Metal packaging began in the triode packaging, and then slowly applied to the straight plug flat packaging, basically a metal-glass assembly process. Strict due to this kind of packaging size, high precision, easy to mass production, metal parts is its low price, excellent performance, and encapsulation process easy and flexible, is widely used in the transistor and the hybrid integrated circuit such as generator, amplifier, frequency discriminator, ac/dc converter, a filter, relay and so on products, now and in the future many micro encapsulation and multichip module (MCM) also used this metal encapsulation. The types of metal packaging include photoelectric device packaging including optical window type, lens type and optical fiber type; The device package includes A type, B type and C type; Hybrid package includes dual in-line type and flat type; Special device package includes rectangular type, multi-layer multi-window type and non-magnetic material type.
The second category: semiconductor ceramic packaging
Early semiconductor packaging is given priority to with ceramic packing, with a highly integrated and high speed development of semiconductor devices, the miniaturization of electronic devices and the reducing of the price, a partial plastic packaging instead of ceramic, but many use of ceramic packages are still has irreplaceable function, especially the improvement of integrated circuit components working frequency, signal transmission speed up and increase the power consumption of the chip, need to select the low resistivity wiring conductor materials, low dielectric constant, high electrical conductivity of insulation materials, etc. There are DIP and SIP ceramic packages. Lsi packages include PGA, PLCC, QFP and BGA.
The third category: semiconductor plastic packaging
Plastic packaging because of its low cost, simple process, and suitable for mass production, and therefore has a strong vitality, since the birth of the development of more and more quickly, in the packaging share of more and more. Plastic packaging currently accounts for more than 95% of the IC market worldwide. In consumer electronics and devices it's basically plastic packaging; In the industrial circuit accounted for a large proportion of its type of packaging type is also the most. The types of plastic packaging are discrete device packaging, including A type and F type; IC package includes SOP, DIP, QFP and BGA.